NCT75
http://onsemi.com
15
PACKAGE DIMENSIONS
SOIC8 NB
CASE 75107
ISSUE AK
SEATING
PLANE
1
4
5
8
N
J
X 45
_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 75101 THRU 75106 ARE OBSOLETE. NEW
STANDARD IS 75107.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN
MAX
MIN
MAX
INCHES
4.80
5.00 0.189
0.197
MILLIMETERS
B
3.80
4.00 0.150
0.157
C
1.35
1.75 0.053
0.069
D
0.33
0.51 0.013
0.020
G
1.27 BSC
0.050 BSC
H
0.10
0.25 0.004
0.010
J
0.19
0.25 0.007
0.010
K
0.40
1.27 0.016
0.050
M
0
8
0
8
N
0.25
0.50 0.010
0.020
S
5.80
6.20 0.228
0.244
X
Y
G
M
Y
M
0.25 (0.010)
Z
Y
M
0.25 (0.010)
Z
S
X
S
M
_
_
_
_
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
mm
inches
SCALE 6:1
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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NCT75/D
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